Recruitment Positions_Join OEIC_Shaanxi Institute of Advanced Oeic Technologies Co

Recruitment Positions

Recruitment Positions
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Device Engineer (Chip Segment) Department: Equipment Process Department Number of Recruits: 1 Date: 2022-12-05

How to Apply

Please send your resume and portfolio (PDF format, 10MB or less) to your company emailhr@chinaoeic.com Indicate your name and position application in the subject line of the email;
Please indicate the name, scale and responsibilities of the project you have participated in in your resume, and indicate the position and expected salary in the body of the email.

Note: Those with excellent work ability will reply within two weeks.

Job Responsibilities:
1. Responsible for the daily inspection, repair, maintenance and abnormal handling of the equipment, ensure the normal operation of the equipment, and make records;
2. Implement monthly, quarterly and annual maintenance plans for equipment;
3. Analyze the cause of equipment failure, formulate improvement measures, reasonably manage and use spare parts, and ensure the safety stock of spare parts;
4. Develop and implement equipment improvement and transformation plans to meet on-site requirements;
5. Assist process engineers to investigate and solve related problems;
6. Compile, revise and improve equipment operation instructions and maintenance instructions, and train relevant personnel;
7. Installation and commissioning of new equipment, monitoring and management of the whole process of new equipment introduction to ensure the normal use of equipment.

Required Core Qualities:
More than 3 years of semiconductor equipment maintenance work experience, can read the equipment manual, familiar with PVDCVDwet methodetchingyellow lightgrinding and polishing and other sections of equipment working principle and maintenance techniques, understand the process principle.

Job Requirements (assessment Indicators Within Half A Year To One Year):
Able to complete equipment installation and commissioning; Preparation of SOPs for operation and maintenance; Daily inspection of chip equipment according to platform requirements; Device exception handling, establish an exception list for analysis; Assist in refurbishment of used used equipment.

Special Requirements:
Able to oncall at any time, respond to customer requests after equipment abnormalities and deal with them in a timely manner.

Electroplating Process Engineer Department: Process Services Department Number of Recruits: 1 Date: 2022-12-05

How to Apply

Please send your resume and portfolio (PDF format, 10MB or less) to your company emailhr@chinaoeic.com Indicate your name and position application in the subject line of the email;
Please indicate the name, scale and responsibilities of the project you have participated in in your resume, and indicate the position and expected salary in the body of the email.

Note: Those with excellent work ability will reply within two weeks.

Send Resume To: hr@chinaoeic.com

Job Responsibilities:
1. Familiar with the characteristics of III-V compound semiconductor GaN/GaAs/InP materials, responsible for on-site process debugging, and assist in completing process tape-outs;|
2. Responsible for process technical support and introduction of new processes in the process of product development;
3. Assist the team in process optimization and abnormal process handling;
4. Establish relevant work instructions and technical documents, and conduct relevant basic training for on-site operators;
5. Cooperate with the equipment department to deal with the abnormalities that occur on site to ensure the normal stability of the product.

Required Core Qualities:
1. Bachelor degree or above, major direction (microelectronics, materials, chemistry, semiconductor physics, optoelectronics, etc.);
2. Have relevant experience in semiconductor wafer plating and wet process, familiar with the principle of electroplating process, be able to independently develop the process of electroplating Au, and accurately locate and solve abnormal problems in electroplating process and issue reports;
3. Have 3 years or more experience in compound semiconductor chip process, familiar with GaAs, GaN and other compound processes;
4. Responsible for serious work, strong execution, good logical thinking ability and problem analysis and solving ability, able to independently carry out new process research and development and verification work.

Job Requirements (assessment Indicators Within Half A Year To One Year):
1. Process debugging and machine inspection for on-site chip line equipment;
2. Meet customer needs, provide process technical support, and assist in product verification;
3. Responsible for the verification and acceptance of new raw materials.

Special Requirements:
Able to handle exceptions in a timely manner at any time.

Process Engineer (Chip Segment) Department: Process Services Department Number of Recruits: 7 Date: 2022-12-05

How to Apply

Please send your resume and portfolio (PDF format, 10MB or less) to your company emailhr@chinaoeic.com Indicate your name and position application in the subject line of the email;
Please indicate the name, scale and responsibilities of the project you have participated in in your resume, and indicate the position and expected salary in the body of the email.

Note: Those with excellent work ability will reply within two weeks.

Send Resume To: hr@chinaoeic.com

Job Responsibilities:
1. Familiar with the characteristics of III-V compound semiconductor GaN/GaAs/InP materials, responsible for on-site process debugging, and assist in completing process tape-outs;
2. Responsible for process technical support and introduction of new processes in the process of product development;
3. Assist the team in process optimization and abnormal process handling;
4. Establish relevant work instructions and technical documents, and conduct relevant basic training for on-site operators;
5. Cooperate with the equipment department to deal with the abnormalities that occur on site to ensure the normal stability of the product.

Required Core Qualities:
1. Bachelor degree or above, professional direction (materials, chemistry, semiconductor physics, optoelectronics, etc.);
2. With rich experience in Stepper process and equipment, familiar with Nikon i9, Nikon i10C and other equipment, can independently create and maintain process menus, and can accurately locate and solve abnormal problems in yellow light process.
3. Have 3 years or more experience in compound semiconductor chip process, familiar with GaAs, GaN and other compound processes;
4. Responsible for serious work, strong execution, good logical thinking ability and problem analysis and solving ability, able to independently carry out new process research and development and verification work.

Special Requirements:
Be able to handle exceptions in time at any time on call.